Methods for automated hardware system synthesis

ABSTRACT

Described is a method comprising a processing, an establishing, and/or a determining. In the processing, an inputted capabilities list including one or more hardware design capabilities may be processed. In the establishing, one or more candidate components for the one or more hardware design capabilities may be established. In the determining, a set of unique candidate netlists capable of satisfying the one or more hardware design capabilities may be determined, the set of unique candidate netlists being based upon the set of candidate components.

CLAIM FOR PRIORITY

The present application claims priority under 35 U.S.C. § 119(e) to U.S.Provisional Patent Application Ser. No. 62/569,412 filed Oct. 6, 2017and entitled “METHODS FOR AUTOMATED HARDWARE SYSTEM SYNTHESIS,” which isherein incorporated by reference in its entirety.

BACKGROUND

Using a programmable silicon interposer as a substrate for designing andmanufacturing new wearable devices or Internet-of-Things (IoT) devicesmay facilitate rapid fabrication of new devices from circuit schematics.The time spent developing schematics for a new device may accordinglybecome a larger fraction of the overall time needed to deliver newsystems, and may thus raise the value of producing these new schematicsmore quickly.

Meanwhile, the most common errors in hardware design may include simpleerrors such as forgotten wires or misplaced wires. Typically, theseerrors may be single-points-of-failure, and may result in multiplere-spins of a board design. Good hardware engineers may draw on theirown experience with known chips in previously used wiring diagrams inorder to minimize or avoid costs in time, money, or both. Still, whendesigning numerous systems in parallel, the time and effort spent ondesign may become costly, and potentially unmanageable.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments of the disclosure will be understood more fully from thedetailed description given below and from the accompanying drawings ofvarious embodiments of the disclosure. However, while the drawings areto aid in explanation and understanding, they are only an aid, andshould not be taken to limit the disclosure to the specific embodimentsdepicted therein.

FIG. 1 illustrates an embedded system, in accordance with someembodiments of the disclosure.

FIG. 2 illustrates embedded systems with masters and multiple slaves, inaccordance with some embodiments of the disclosure.

FIGS. 3A-3B illustrate a flow diagram for a Hardware System Synthesis(HSS) tool, in accordance with some embodiments of the disclosure.

FIGS. 4A-4B illustrate a flow diagram for an HSS tool, in accordancewith some embodiments of the disclosure.

FIG. 5 illustrates a diagram of an HSS tool, in accordance with someembodiments of the disclosure.

FIG. 6 illustrates a computing device with mechanisms for HSS, inaccordance with some embodiments of the disclosure.

DETAILED DESCRIPTION

Using programmable silicon interposers as substrates for designing andmanufacturing new wearable devices or Internet-of-Things (IoT) devicesmay facilitate rapid fabrication of new devices from circuit schematics.Meanwhile, common errors in hardware design (e.g., simple forgottenwires or misplaced wires) may be single-points-of-failure resulting inmultiple re-spins of a board design. When designing numerous systems inparallel, the time and effort spent on design may become costly, andpotentially unmanageable.

Disclosed herein are mechanisms and methods related to system designautomation, verification, and validation for improved efficiency inhardware development, such as for IoT applications or wearableapplications. Some embodiments may comprise automated Hardware SystemSynthesis (HSS) tools operable to generate one or more systems onprogrammable silicon interposers that may have specific featuresselected by a user. Some embodiments may comprise systems that may beverified by hardware checks prior to presenting results to a user, whichmay advantageously reduce design time and may mitigate various risks ofhardware design. By reducing a degree of complexity of hardware design,an overall design space may advantageously be expanded to allow for moresystem designs in a shorter design cycle.

Discussed herein are various methods and mechanisms for HSS tools thatmay advantageously reduce risks of designing many systems in parallel,by providing designers with automatically generated baseline systemswhich may pass a given set of electrical checks (such as Electrical RuleChecker (ERC) checks) and physical checks (such as Design Rule Checker(DRC) checks). By automating initial system builds, simple wiring errorsmay be avoided. Moreover, pre-built systems may be stored in a commonhistory table (e.g., a database) accessible to all designers, which mayfacilitate leveraging the experiences of other designers, and may inturn provide more creative choices with less attendant risk.

In the following description, numerous details are discussed to providea more thorough explanation of embodiments of the present disclosure. Itwill be apparent to one skilled in the art, however, that embodiments ofthe present disclosure may be practiced without these specific details.In other instances, well-known structures and devices are shown in blockdiagram form, rather than in detail, in order to avoid obscuringembodiments of the present disclosure.

Note that in the corresponding drawings of the embodiments, signals arerepresented with lines. Some lines may be thicker, to indicate a greaternumber of constituent signal paths, and/or have arrows at one or moreends, to indicate a direction of information flow. Such indications arenot intended to be limiting. Rather, the lines are used in connectionwith one or more exemplary embodiments to facilitate easierunderstanding of a circuit or a logical unit. Any represented signal, asdictated by design needs or preferences, may actually comprise one ormore signals that may travel in either direction and may be implementedwith any suitable type of signal scheme.

Throughout the specification, and in the claims, the term “connected”means a direct electrical, mechanical, or magnetic connection betweenthe things that are connected, without any intermediary devices. Theterm “coupled” means either a direct electrical, mechanical, or magneticconnection between the things that are connected or an indirectconnection through one or more passive or active intermediary devices.The term “circuit” or “module” may refer to one or more passive and/oractive components that are arranged to cooperate with one another toprovide a desired function. The term “signal” may refer to at least onecurrent signal, voltage signal, magnetic signal, or data/clock signal.The meaning of “a,” “an,” and “the” include plural references. Themeaning of “in” includes “in” and “on.”

The terms “substantially,” “close,” “approximately,” “near,” and “about”generally refer to being within +/−10% of a target value. Unlessotherwise specified the use of the ordinal adjectives “first,” “second,”and “third,” etc., to describe a common object, merely indicate thatdifferent instances of like objects are being referred to, and are notintended to imply that the objects so described must be in a givensequence, either temporally, spatially, in ranking, or in any othermanner.

It is to be understood that the terms so used are interchangeable underappropriate circumstances such that the embodiments of the inventiondescribed herein are, for example, capable of operation in otherorientations than those illustrated or otherwise described herein.

The terms “left,” “right,” “front,” “back,” “top,” “bottom,” “over,”“under,” and the like in the description and in the claims, if any, areused for descriptive purposes and not necessarily for describingpermanent relative positions.

For the purposes of the present disclosure, the phrases “A and/or B” and“A or B” mean (A), (B), or (A and B). For the purposes of the presentdisclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B),(A and C), (B and C), or (A, B and C).

In addition, the various elements of combinatorial logic and sequentiallogic discussed in the present disclosure may pertain both to physicalstructures (such as AND gates, OR gates, or XOR gates), or tosynthesized or otherwise optimized collections of devices implementingthe logical structures that are Boolean equivalents of the logic underdiscussion.

When a new system is envisioned, a designer may start with a problem tobe solved or an activity to help a user accomplish. This may lead toidentifying certain actions a system may undertake in response either toinput from a user or to changes in an environment which might come fromsensors (e.g., time, location, temperature, and so on). Additionalinputs may be provided by cloud-based sensors (e.g., a user's calendaror a user's email). Such inputs may in turn be used to identify one ormore capabilities a system may be targeted to have, either as input(e.g., pertaining to a clock, a Global Positioning System (GPS)circuitry, an accelerometer, a gyroscope, a magnetometer, a thermometer,a hygrometer, a barometer, and so on) or to complete an activity (e.g.,a microprocessor, a radio, a display, and/or a speaker). Finally, thecapabilities may be used to design hardware (e.g., a schematic or anetlist) that may carry out one or more targeted tasks, and may be usedto develop software to carry out the desired actions in a preferredorder and in response to specified inputs.

Various designs may incorporate a programmable silicon interposer onwhich various components, or “chiplets,” may be mounted. Theprogrammable silicon interposer may be (or may include) an integratedcircuit, while the chiplets may be (or may include) semiconductor dies,integrated circuits, and/or semiconductor chips. The chiplets may havesmaller footprints (e.g., smaller x-dimensions and y-dimensions) thanthe interposer, and in various embodiments, multiple chiplets may fitwithin the footprint of the interposer.

The use of a programmable silicon interposer as a substrate forelectrical connections may increase system design flexibility. However,the increase in design flexibility may result in a significant increasein verification and validation because of the proliferation of a set ofsystems being supported. Due to the manual nature of hardware design,this explosion in complexity may also lead to an increased probabilityof errors, which may in turn translate to longer verification cycles,validation cycles, and ultimately time-to-market.

To mitigate such effects, automation may be employed at various steps inthe design process. The hardware design of a system may benefitsignificantly from automation. Design automation for hard-wired systemsmay be challenging at this step due to their relatively inflexibilenatures. In addition, each system may be unique and may have its own setof targeted features or capabilities. The use of programmable siliconinterposers may accordingly facilitate automation at this step, sincevarious errors may be quickly corrected with relatively simple changesin software, and a plurality of systems supported on a substrate mayshare common attributes which might be leveraged for automating certainparts of the hardware design.

State of the art system design tools, such as High-Level Synthesis (HLS)tools, may require a complete description of the desired systembehavior. From this description, the tools may then automaticallygenerate schematic netlists and software that implements the desiredbehavior. This approach may be desirable when a completely new system isbeing developed, but might be impractical when the goal is to develop asystem out of existing components for which complete behavioral modelsmight not be available or provided.

As disclosed herein, an alternative path may be to use an HSS tool tosynthesize a schematic netlist directly from a set of capabilities thata system (and thus its hardware) may be targeted to possess, instead offrom behavioral models (e.g., a set of behaviors that the system may betargeted to carry out). This version of system design automation mayadvantageously work around a lack of behavioral models by focusing onwiring specifications for specific communication protocols (e.g.,inter-component communication protocols, such as the Inter-IntegratedCircuit (I2C) protocol and the Serial Peripheral Interface (SPI)protocol) and system power specifications.

An HSS tool may give communication protocols priority based upon theexistence of firmware support. By supporting merely configurations orsub-configurations for which firmware already exists, software risk maybe mitigated. A user may first specify a type of system by listingcapabilities that the system may be targeted to provide: e.g., numbersand types of sensors, communication protocols, and so on. The HSS toolmay then generate a set of functional systems that pass ERC and/or DRC,which an engineer may review. From these baseline designs, the engineermay modify specific areas to create a unique design. Such a design flowmay thereby advantageously reduce the risk of simple errors in powerconnections or general communication schemes.

An HSS process may start with a list of capabilities that hardware maybe targeted to provide. The starting point may also include one or moreuser preferences regarding components. For example, one preference maybe that a system be built around a specific microprocessorSystem-on-a-Chip (SoC) (which for which the designer may already have asignificant amount of software, or may use certain sensors and/orinterface types). Another preference may be that the system be builtaround a specific communication protocol (e.g., I2C, SPI, or anotherprotocol).

Such parameters may then be used to generate a set of system schematicnetlists which may satisfy all of the user preferences. Finally, each ofthose implementations (e.g., each generated system schematic netlist)may be checked against ERC rules and/or DRC rules.

In some embodiments, systems passing the various checks may be ranked,and top candidates may be presented to a user. Ranking may be based on avariety of attributes such as how well the system meets userpreferences, cost, risk, size, and/or power.

Since systems may be synthesized from components for which completebehavioral descriptions may be potentially unavailable, some importantcapabilities may be extracted from a part's datasheet. (Presently, thisextraction may be done by an engineer.) For each component (e.g., chip)potentially used by the system, key information may be entered into adatabase describing that particular component. This information mayinclude a component's capabilities, electrical behavior, cost, andsupported communication interfaces (including whether the interface isoptional or non-optional). Once the database is populated with criticalcomponent information, a solution space may be defined for system typesand corresponding functionalities for an automatic generation of systemsfrom the given information.

Programmable silicon interposers may reduce a size of compact,power-efficient embedded system applications beyond what is possiblewith current Printed Circuit Board (PCB) technology. FIG. 1 illustratesan embedded system, in accordance with some embodiments of thedisclosure. A system 100 may comprise an SoC 110, amicroelectromechanical systems (MEMs) temperature-compensated crystaloscillator (TCXO) 120, and/or a memory 130 (which may be a nonvolatilememory, such as a flash memory). System 100 may also comprise one ormore sensors, such as a first sensor 141, a second sensor 142, and soon, up to an Nth sensor 149. In various embodiments, SoC 110 may itselfcomprise a microprocessor unit (MPU) 111, which may have one or moreprocessing cores, and/or a radio unit 112.

System 100 may accordingly comprise one or more of an MPU, a memory, aclock, numerous sensors, and a radio. In some embodiments, an MPU and aradio (e.g., a Bluetooth Low-Energy (BLE) circuitry) may be integrateddirectly onto the component as an SoC, and the memory and/or one or moreof the sensors may be controlled by the SoC. In some embodiments, clockdevices (e.g., a TXCO) may also be integrated into system 100, and mayprovide various clock signals to system 100. In various embodiments, oneor more of MPU 111, radio 112, TCXO 120, memory 130, and/or first sensor141 through Nth sensor 149 may be integrated into the same SoC die.

Various systems may be conceptually simplified as implementing one ormore communication protocols having a master component (e.g., a“keystone” component) and multiple slave components.

FIG. 2 illustrates embedded systems with masters and multiple slaves, inaccordance with some embodiments of the disclosure. A first system 200may comprise an I2C master 210 and one or more I2C slaves, such as afirst I2C slave 221 through an Nth I2C slave 229. I2C master 210 mayoutput an I2C serial clock (SCLK) signal and an I2C serial data (SDA)signal. First I2C slave 221 through Nth I2C slave 229 may accept asinputs the I2C SCLK signal and the I2C SDA signal. First system 200 mayaccordingly implement an I2C bus between an I2C master and one or moreI2C slaves.

A second system 250 may comprise an SPI master 260 and one or more SPIslaves, such as a first SPI slave 271 through an Nth SPI slave 279.Master 260 may output an SPI serial clock SCLK signal, an SPImaster-out-slave-in (MOSI) signal, an SPI master-in-slave-out (MISO)signal, and/or a first SPI chip select (CS) signal through an Nth SPI CSsignal (respectively corresponding with first SPI slave 271 through NthSPI slave 279). First SPI slave 271 through Nth SPI slave 279 may acceptas inputs the SPI SCLK signal, the SPI MOSI signal, and the SPI MISOsignal. In addition, first SPI slave 271 may accept as input the firstSPI CS signal, and so on, through Nth SPI slave 279, which may accept asinput the Nth SPI CS signal. (For example, first SPI slave 271 throughNth SPI slave 279 may accept as input the respectively correspondingfirst SPI CS signal through Nth SPI CS signal.) Second system 250 mayaccordingly implement an SPI bus between an SPI master and one or moreSPI slaves.

Components in various systems may communicate through various protocols,such as the I2C protocol and/or the SPI protocol. The I2C protocol andthe SPI protocol may be advantageous initial-communication protocols,since (from a design perspective) the I2C protocol and/or the SPIprotocol may advantageously be verified as having have supportedfirmware prior to being included in a designed system.

Once a user lists capabilities that a system may be targeted to provide,an HSS tool may be triggered (e.g., automatically triggered) to buildall possible unique baseline systems corresponding with thosecapabilities. The HSS tool may also run system checks (e.g., ERC checksand/or DRC checks) to verify validity and whether all the targetedcapabilities exist. The resulting systems and their checker results maythen be presented to a user for review.

FIGS. 3A-3B illustrate a flow diagram for an HSS tool, in accordancewith some embodiments of the disclosure. A flow 300 may comprise a start310, a first portion 321, a second portion 322, a third portion 323, afourth portion 324, a fifth portion 325, a sixth portion 326, a firstcondition 331, and/or an end 390.

Flow 300 may also have an I2C part comprising a first I2C condition 351,a first I2C portion 341, a second I2C portion 342, a third I2C portion343, and/or a fourth I2C portion 344. Flow 300 may also have an SPI partcomprising a first SPI condition 371, a first SPI portion 361, a secondSPI portion 362, a third SPI portion 363, and/or a fourth SPI portion364.

Following start 310, flow 300 may proceed to first portion 321. In firstportion 321, system information may be read from a user (e.g., via afile or other input from the user). The system information may include,for example, specified capabilities of the desired system, such as thetype of system, a number and/or type of sensors of the system,communication protocols used by the system, a desired microprocessor forthe system, desired voltage supplies, desired clocking parameters,desired power supply support (e.g., battery charger support), powertargets, delivery schedule impact, lab verification impact, productimplementation history, cost, size, and/or user component preferences.

Then, in second portion 322, a list of candidate “keystone”configurations (CFG_IDs) that may meet the specified capabilities may bemay be generated. A first parameter may then be set to the number ofcandidate keystone CFG_IDs (e.g., a “num_cfgs” parameter), and a secondparameter to be used as an index (e.g., an “i” parameter) may beinitialized to zero. Each keystone CFG_ID may be associated with acomponent capable of being a master to one or more of the communicationprotocols of the system (e.g., a component capable of being an I2Cmaster and/or an SPI master). Flow 300 may then proceed to firstcondition 331.

In first condition 331, if the second parameter i is less than or equalto the first parameter num_cfgs, then flow 300 may proceed to thirdportion 323; otherwise, flow 300 may proceed to fourth portion 324. Inthird portion 323, one or more communication protocols to be supportedfor keystone CFG_ID number i may be determined (e.g., based upon theuser's capabilities list and/or system information). Flow 300 may thenproceed in parallel to its I2C part and/or its SPI part (e.g., basedupon wither instances of the I2C protocol and/or the SPI protocol arepresent among the components of keystone CFG_ID number i).Alternatively, in some embodiments, flow 300 may proceed to its I2C partand its SPI part in series.

For the I2C part of flow 300, in first I2C condition 351, flow 300 maydetermine whether keystone CFG_ID number i includes any instances of theI2C protocol. If so, flow 300 may proceed through first I2C portion 341,second I2C portion 342, and third I2C portion 343; otherwise, flow 300may proceed through fourth I2C portion 344.

In first I2C portion 341, a parameter pertaining to a number of slaveI2C components of keystone CFG_ID number i (“num_i2c_slaves”) may befound or determined. In second I2C portion 342, a “cross-product” ofpossible configurations of I2C-based components may be computed. Thecross-product may be a list of all possible combinations of I2C-basedcomponents that are known to the HSS tool that may satisfy at least partof the user's capabilities list. In third I2C portion 343, systems(e.g., system descriptions) based upon the possible combinations ofcomponents identified in second I2C portion 342 may be built orgenerated, and flow 300 may then proceed to fifth portion 325. Incontrast, in fourth I2C portion 344, no systems (e.g., systemdescriptions) are built or generated, and flow 300 may proceed directlyto fifth portion 325.

Meanwhile, for the SPI part of flow 300, in first SPI condition 371,flow 300 may determine whether keystone CFG_ID number i includes anyinstances of the SPI protocol. If so, flow 300 may proceed through firstSPI portion 361, second SPI portion 362, and third SPI portion 363;otherwise, flow 300 may proceed through fourth SPI portion 364.

In first SPI portion 361, a parameter pertaining to a number of slaveSPI components of keystone CFG_ID number i (“num_spi_slaves”) may befound or determined. In second SPI portion 362, a “cross-product” ofpossible configurations of SPI-based components may be computed. Thecross-product may be a list of all possible combinations of SPI-basedcomponents that are known to the HSS tool that may satisfy at least partof the user's capabilities list. In third SPI portion 363, systems(e.g., system descriptions) based upon the possible combinations ofcomponents identified in second SPI portion 362 may be built orgenerated, and flow 300 may then proceed to fifth portion 325. Incontrast, in fourth SPI portion 364, no systems (e.g., systemdescriptions) are built or generated, and flow 300 may proceed directlyto fifth portion 325.

Accordingly, once both the I2C part and the SPI part have been completedfor keystone CFG_ID number i, flow 300 may have identified both a set ofall possible combinations of I2C-based components that are known to theHSS tool that may satisfy at least part of the user's capabilities list,and a set of all possible configurations of SPI-based components thatare known to the HSS tool that may satisfy at least part of the user'scapabilities list. (Note that flow 300 may have additional partsparallel to the I2C part and the SPI part, which may identify sets ofall possible configurations of components based upon other, differentcommunication protocols that may be known to the HSS to that may satisfyat least part of the user's capabilities list.)

Then, in fifth portion 325, flow 300 may compute another “cross-product”between the set of all possible configurations of I2C-based components(as identified by the I2C part) and/or the set of all possibleconfigurations of SPI-based components (as identified by the SPI part).The cross-product may accordingly generate a set of unique systemsspanning all possible combinations of I2C-based components and/orSPI-based components that may satisfy the I2C protocol instances and/orthe SPI protocol instances of keystone CFG_ID number i. Once thecross-product of fifth portion 325 is computed (and, e.g., stored in amemory), flow 300 may proceed to sixth portion 326, in which the second,index parameter i may be incremented. Flow 300 may then return to firstcondition 331.

Once the second parameter i is no longer less than or equal to the firstparameter num_cfgs—e.g., when all of the num_cfgs keystone CFG_IDs havebeen iterated through, and all possible configurations of I2C-basedcomponents and SPI-based components have been identified for eachkeystone CFG_ID—then flow 300 may have identified a set of systemsspanning all possible combinations of slave-components andmaster-components capable of satisfying the system information read fromthe user (including, e.g., the list of capabilities targeted for thesystem). Flow 300 may proceed to fourth portion 324 (as mentionedabove).

In fourth portion 324, the identified set of systems may be sent to DRCcheckers, ERC checkers, and/or other checkers (e.g., thermal rulecheckers, power rule checkers, timing checkers, noise checkers, and soon). Following fourth portion 324, flow 300 may proceed to end 390.

The flow diagram of FIGS. 3A-3B may pertain to user-driven HSS flows. Invarious embodiments, an HSS tool flow may be initiated or started by auser. Resulting systems and their corresponding checker results may beaccumulated (e.g., by being placed in a queue) for a user to verify andapprove prior to being storing in the history table (e.g., a database).

In some embodiments, an HSS tool flow may be triggered by an event suchas the entry of a new component into the history table of the HSS tool.For example, a user may add a new component and its corresponding pininformation into a database. Once submitted, the HSS tool may again betriggered to build all possible unique systems and run specified orpredetermined checks, and resulting systems and their correspondingchecker results may be accumulated for a user to verify and approveprior to being storing in the history table.

FIGS. 4A-4B illustrate a flow diagram for an HSS tool, in accordancewith some embodiments of the disclosure. A flow 400 may comprise a start410, a first portion 421, a second portion 422, a third portion 423, afourth portion 424, a fifth portion 425, a sixth portion 426, a firstcondition 431, and/or an end 490.

Flow 400 may also have an I2C part comprising a first I2C condition 451,a first I2C portion 441, a second I2C portion 442, a third I2C portion443, and/or a fourth I2C portion 444. Flow 400 may also have an SPI partcomprising a first SPI condition 471, a first SPI portion 461, a secondSPI portion 462, a third SPI portion 463, and/or a fourth SPI portion464.

Flow 400 may be substantially similar to flow 300. In first portion 421,one or more component identifiers or chip identifiers (CIDs) may bespecified by a user (such as a keystone CID, or a component serving as amaster for a communication protocol), and in second portion 422, anumber of keystone CFG_IDs corresponding with the one or more specifiedcomponents may be generated, a first parameter may be set to the numberof keystone CFG_IDs (e.g., a “num_cfgs” parameter), and a secondparameter to be used as an index (e.g., an “i” parameter) may beinitialized to zero. In some embodiments, one or more CIDs may bespecified by a user, along with system information that may be specifiedby the user. Accordingly, in comparison with flow 300, flow 400 maysupport searching over a smaller solution-space to synthesize possiblesystems.

The flow diagram of FIG. 4 may pertain to database-initiated flows. Thissecond flow may enable an HSS tool to build and check one or moresystems overnight, storing the results in a history table (e.g., adatabase). In some embodiments, when a user wants to generate systemsusing the first flow (e.g., flow 300), the HSS tool may check thehistory table first to see if any of the built systems match therequirements of the user, which may advantageously reduce the tool's runtime.

Although the actions in the flowchart with reference to FIGS. 3A-4B areshown in a particular order, the order of the actions can be modified.Thus, the illustrated embodiments can be performed in a different order,and some actions may be performed in parallel. Some of the actionsand/or operations listed in FIGS. 3A-4B are optional in accordance withcertain embodiments. The numbering of the actions presented is for thesake of clarity and is not intended to prescribe an order of operationsin which the various actions must occur. Additionally, operations fromthe various flows may be utilized in a variety of combinations.

In some embodiments, an apparatus may comprise means for performingvarious actions and/or operations of the methods of FIGS. 3A-4B.

Moreover, in some embodiments, machine readable storage media may haveexecutable instructions that, when executed, cause one or moreprocessors to perform an operation comprising the methods of FIGS.3A-4B. Such machine readable storage media may include any of a varietyof storage media, like magnetic storage media (e.g., magnetic tapes ormagnetic disks), optical storage media (e.g., optical discs), electronicstorage media (e.g., conventional hard disk drives, solid-state diskdrives, or flash-memory-based storage media), or any other tangiblestorage media or non-transitory storage media.

FIG. 5 illustrates a diagram of an HSS tool, in accordance with someembodiments of the disclosure. An HSS tool 500 may have access to adatabase comprising a number L of keystone chiplets 510 (e.g., chipletscapable of being a master for one or more communication protocols) and anumber P of slave chiplets 520.

For the L keystone chiplets 510 in the database, which may be numberedfrom K₀ through K_(L), each keystone chiplet K may have a total number Rof keystone CFG_IDs (e.g., each keystone chiplet K may have a number ofconfigurations from KC₀ through KC_(R)). Each of keystone chiplets 510(e.g., spanning K₀ through K_(L)) may also correspond to a uniquekeystone CID.

For the P slave chiplets 520 in the database, which may be numbered fromS₀ through S_(P), each slave chiplet may correspond with various I2Cconfigurations and/or various SPI configurations. For example, eachslave chiplet may correspond with a total number N of I2C configurations(e.g., each slave chiplet S may have a number of I2C configurations fromSI2CC₀ through SI2CC_(N)). Similarly, each slave chiplet may correspondwith a total number M of SPI configurations (e.g., each slave chiplet Smay have a number of SPI configurations from SSPIC₀ through SSPIC_(M)).

A system synthesis process 530 having access to the database comprisingboth keystone chiplets K₀ through K_(L) and slave chiplets S₀ throughS_(P) may then synthesize a number of systems based upon the keystonechiplets and slave chiplets.

Hardware synthesis process 530 may have a number of portions. In a firstportion, system synthesis process 530 may choose a keystone CID (e.g.,one of K₀ through K_(L)) and a keystone CFG_ID (e.g., from KC₀ throughKC_(R)). In a second portion, the keystone CFG_ID may be decoded todetermine configuration information (e.g., system information, such assystem capabilities). In a third portion, a number Y of systems spanningthe solution space may be generated. In some embodiments, Y may equal Pchoose A and B, where A may be a number of I2C components and B may be anumber of SPI components. In a fourth portion, a unique systemidentification number (SYS_ID) may be assigned to each of the Y systems.

In a fifth portion, system synthesis process 530 may repeat the firstportion through the fourth portion for the remaining keystone CFG_IDsassociated with the chosen keystone CID. In a sixth portion, systemsynthesis process 530 may choose the next keystone CID (e.g., the nextof K₀ through K_(L)), and may repeat the first portion through the fifthportion for the remainder of the Keystone chiplets 510 (e.g., for theremainder of the keystone CIDs). Sample expanded configurations forsystem identification numbers SYS_0, SYS_1, and SYS_Y, correspondingwith a keystone CFG_ID KC₀, are provided below.

SYS_0: { Kx, KC₀; S₀, SI2CC₀; ... ; S_(B−1), SI2CC_(B−1); S_(B),SSPIC_(B); ... ; S_(A+B), SSPIC_(A+B) } SYS_1: { Kx, KC₀; S_(P−(A+B−1)),SI2CC_(P−(A+B−1)); ... ; S_(P−(B−2)), SI2CC_(P−(B−2)); S_(P−(B−1)),SSPIC_(P−(B−1)); ... ; S_(P−1), SSPIC_(P−1) } SYS_Y: { Kx, KC₀;S_(P−(A+B)), SI2CC_(P−(A+B)); ... ; S_(P−(B−1)), SI2CC_(P−(B−1));S_(P−B), SSPIC_(P−B); ... ; S_(P), SSPIC_(P) }Similar expanded configurations may exist for the remainder of thekeystone CIDs (e.g., from KC₁ through KC_(R)).

In various embodiments, a keystone component may be an SoC. Sensors andmemory components may be slaves, and an SoC may control each using achosen communication protocol. Each component may have various possiblewiring configurations (with corresponding identifiers (e.g., CFG_IDs))available for building systems. Each CFG_ID may contain some or allinformation pertaining to selection in a unique system, such asfunctionality (e.g., whether a component is a keystone component or aslave component), slave information (e.g., a number of slaves, or aslave index), power management (PM) information, protocol information(e.g., I2C, SPI, etc.), and so forth.

In accordance with flow 300, flow 400, and/or HSS tool 500, an HSS toolas described herein may use a keystone component's CFG_ID as an anchorto begin system synthesis. From this CFG_ID, the HSS tool may decodevarious components for building a specific system, and may beginsearching for candidate components. The HSS tool may calculate ordetermine one or more combinations, and may make a list of all possiblesystems (e.g., without any duplicates). For example, if a database has atotal of P slaves available, and the protocols are determined to be(e.g., decoded as) one I2C protocol with A slaves and one SPI protocolwith B slaves, a total number of systems may be calculated through amultinomial coefficient of P choose A and B.

In some embodiments, once the list is generated, the HSS tool may searcha history table (e.g., a build history or database) for anypreviously-built systems, and may then build the remaining systems onthe list, assigning a unique system identifier (e.g., a SYS_ID), whichmay contain both a CID and a chosen wiring configuration (e.g., aCFG_ID). Upon completion, all the systems may be added to a check tableto prepare for full placement and routing on a silicon interposer, andfor ERC checks, DRC checks, and/or checks of other checkers (asdiscussed herein). Pass/fail flags may be added to show the status ofthe system along the process. Failed systems may either be reconfiguredfor rechecking or discarded completely.

Once a system is built and passes all checks, it may be approved by asystem designer, who may use the system as is, or may modify portions ofthe system as desired. If modified, the new system may be given a newunique SYS_ID (and may preferably be run through the same checks asprior to approval). All generated systems may be stored in a historytable (e.g., a database) for the next round of builds. A user may thengenerate silicon interposer programming and/or mechanical collateral forany approved systems.

In some embodiments, other system information, such as SoC powermanagement, may be independent of communication protocols. As a result,automation may be added in parallel and attached to the system at theend of the building process. Other building information (e.g.,pertaining to voltage domains) which may impact a chosen componentconfiguration (e.g., a CFG_ID) may be added to the builder in series.Once complete, one or more functional hardware systems may be presentedto the end user. In some embodiments, the system may still wait for thecompletion of software verification and/or validation prior to building.

In various embodiments, with reference to flow 300, flow 400, and/or HSStool 500, a method may comprise a processing, an establishing, and adetermining. In some embodiments, machine readable storage media (asdescribed here) may have executable instructions that, when executed,cause one or more processors to perform an operation comprising suchmethods.

In the processing, an inputted capabilities list including one or morehardware design capabilities may be processed. In the establishing, oneor more candidate components for the one or more hardware designcapabilities may be established. In the determining, a set of uniquecandidate netlists capable of satisfying the one or more hardware designcapabilities may be determined, the set of unique candidate netlistsbeing based upon the set of candidate components.

In some embodiments, the inputted capabilities list may comprise asensor. For some embodiments, the unique candidate netlists mayincorporate components interconnected via a silicon interposer. In someembodiments, the one or more candidate components include amicroprocessor.

For some embodiments, the establishing may include one or morepredetermined components (e.g. components identified by a user, such asby CID, to focus or limit the solution space or design space), and theunique candidate netlists may include the one or more predeterminedcomponents. In some embodiments, the one or more predeterminedcomponents may include a microprocessor (e.g., a keystone component).For some embodiments, the one or more candidate components support atleast one communication protocol (such as I2C or SPI, or anothercommunication protocol).

In some embodiments, the method may comprise an analyzing. In theanalyzing, the set of unique candidate netlists may be based upon one ormore solution space constraints to produce a corresponding set ofrankings for the set of unique candidate netlists. For some embodiments,the solution space constraints may include a size constraint, a powerconstraint, a cost constraint, and/or a preferred-component constraint.In some embodiments, the method may comprise a verifying. In theverifying, the set of unique candidate netlists may be verified againstone or more rule-sets. For some embodiments, the one or more rule-setsmay include an ERC rule-set, a DRC rule-set, and/or another checker'srule-set.

In various embodiments, with reference to flow 300, flow 400, and/or HSStool 500, a method may comprise a first processing, a second processing,a determining, and an analyzing. In some embodiments, machine readablestorage media (as described here) may have executable instructions that,when executed, cause one or more processors to perform an operationcomprising such methods.

In the first processing, an inputted capabilities list including one ormore hardware design capabilities may be processed. In the secondprocessing, an inputted set of system information may be processed, theinputted set of system information including one or more candidatecomponents for the one or more hardware design capabilities and one ormore solution space constraints. In the determining, a set of uniquecandidate netlists capable of satisfying the one or more hardware designcapabilities may be determined, the set of unique candidate netlistsbeing based upon the set of candidate components. In the analyzing, theset of unique candidate netlists may be analyzed based upon the one ormore solution space constraints to produce a corresponding set ofrankings for the set of unique candidate netlists.

In some embodiments, the unique candidate netlists may incorporatecomponents interconnected via a silicon interposer. For someembodiments, the establishing may include one or more predeterminedcomponent, and the unique candidate netlists may include the one or morepredetermined components. In some embodiments, the one or more candidatecomponents may support at least one communication protocol. For someembodiments, the method may comprise a verifying. In the verifying, theset of unique candidate netlists may be verified against one or morerule-sets.

Some advantages of the HSS tool may accrue over time. As the HSS tool isused, and the HSS tool generates numerous supported systems at variousstages of development (e.g., prototype, production, and so on), it mayadvantageously acquire increasingly-sophisticated data about varioussystem configurations. Historical information related to the generatedsystems (e.g., via a history table) may be fed into the tool to providea user with confidence indicators. For example, if one system has merelybeen built and tested under limited conditions in a lab, it may have alower confidence rating than another equivalent system which has beenshipped in high volume. Such information may assist a user in choosing asystem with a higher probability of functioning, and may also showpatterns of acceptable component pairings.

Over time, the HSS tool or a user may recognize that a specificcomponent pairing or combination has faulty behavior and should beavoided to increase the likelihood of a successful build. A similaranalysis may also be applied with respect to cost. Hardware systemsbuilt and shipped in previous products may cost less than systems whichhave not yet undergone high volume validation, and such information maybe provided to a user as well.

Accordingly, the mechanisms and methods disclosed herein mayadvantageously provide as many valid hardware systems to a user aspossible, with as much corresponding information as possible, to improvethe decision as to which system best fits the user's need.

FIG. 6 illustrates a computing device with mechanisms for HSS, inaccordance with some embodiments of the disclosure. Computing device 600may be a computer system, a System-on-a-Chip (SoC), a tablet, a mobiledevice, a smart device, an IoT device, a wearable device, or a smartphone with mechanisms for HSS, in accordance with some embodiments ofthe disclosure. It will be understood that certain components ofcomputing device 600 are shown generally, and not all components of sucha device are shown FIG. 6. Moreover, while some of the components may bephysically separate, others may be integrated within the same physicalpackage, or even on the same physical silicon die. Accordingly, theseparation between the various components as depicted in FIG. 6 may notbe physical in some cases, but may instead be a functional separation.It is also pointed out that those elements of FIG. 6 having the samenames or reference numbers as the elements of any other figure canoperate or function in any manner similar to that described, but are notlimited to such.

In various embodiments, the components of computing device 600 mayinclude any of a processor 610, an audio subsystem 620, a displaysubsystem 630, an I/O controller 640, a power management component 650,a memory subsystem 660, a connectivity component 670, one or moreperipheral connections 680, and one or more additional processors 690.In some embodiments, processor 610 may include mechanisms for HSS, inaccordance with some embodiments of the disclosure. In variousembodiments, however, any of the components of computing device 600 mayinclude mechanisms for HSS, in accordance with some embodiments of thedisclosure. In addition, one or more components of computing device 600may include an interconnect fabric having a plurality of ports, such asa router, a network of routers, or a Network-on-a-Chip (NoC).

Processor 610 may be a general-purpose processor or CPU (CentralProcessing Unit). In some embodiments, processor 610 may include one ormore physical devices, such as microprocessors, application processors,microcontrollers, programmable logic devices, or other processing means.The processing operations performed by processor 610 may include theexecution of an operating platform or operating system on whichapplications and/or device functions may then be executed. Theprocessing operations may also include operations related to one or moreof the following: audio I/O; display I/O; power management; connectingcomputing device 600 to another device; and/or I/O (input/output) with ahuman user or with other devices.

Audio subsystem 620 may include hardware components (e.g., audiohardware and audio circuits) and software components (e.g., driversand/or codecs) associated with providing audio functions to computingdevice 600. Audio functions can include speaker and/or headphone outputas well as microphone input. Devices for such functions can beintegrated into computing device 600, or connected to computing device600. In one embodiment, a user interacts with computing device 600 byproviding audio commands that are received and processed by processor610.

Display subsystem 630 may include hardware components (e.g., displaydevices) and software components (e.g., drivers) that provide a visualand/or tactile display for a user to interact with computing device 600.Display subsystem 630 may include a display interface 632, which may bea particular screen or hardware device used to provide a display to auser. In one embodiment, display interface 632 includes logic separatefrom processor 610 to perform at least some processing related to thedisplay. In some embodiments, display subsystem 630 includes a touchscreen (or touch pad) device that provides both output and input to auser.

I/O controller 640 may include hardware devices and software componentsrelated to interaction with a user. I/O controller 640 may be operableto manage hardware that is part of audio subsystem 620 and/or displaysubsystem 630. Additionally, I/O controller 640 may be a connectionpoint for additional devices that connect to computing device 600,through which a user might interact with the system. For example,devices that can be attached to computing device 600 might includemicrophone devices, speaker or stereo systems, video systems or otherdisplay devices, keyboard or keypad devices, or other I/O devices foruse with specific applications such as card readers or other devices.

As mentioned above, I/O controller 640 can interact with audio subsystem620 and/or display subsystem 630. For example, input through amicrophone or other audio device can provide input or commands for oneor more applications or functions of computing device 600. Additionally,audio output can be provided instead of, or in addition to, displayoutput. In another example, if display subsystem 630 includes a touchscreen, the display device may also act as an input device, which can beat least partially managed by I/O controller 640. There can also beadditional buttons or switches on computing device 600 to provide I/Ofunctions managed by I/O controller 640.

In some embodiments, I/O controller 640 manages devices such asaccelerometers, cameras, light sensors or other environmental sensors,or other hardware that can be included in computing device 600. Theinput can be part of direct user interaction, and may provideenvironmental input to the system to influence its operations (such asfiltering for noise, adjusting displays for brightness detection,applying a flash for a camera, or other features).

Power management component 650 may include hardware components (e.g.,power management devices and/or circuitry) and software components(e.g., drivers and/or firmware) associated with managing battery powerusage, battery charging, and features related to power saving operation.

Memory subsystem 660 may include one or more memory devices for storinginformation in computing device 600. Memory subsystem 660 can includenonvolatile memory devices (whose state does not change if power to thememory device is interrupted) and/or volatile memory devices (whosestate is indeterminate if power to the memory device is interrupted).Memory subsystem 660 can store application data, user data, music,photos, documents, or other data, as well as system data (whetherlong-term or temporary) related to the execution of the applications andfunctions of computing device 600.

Some portion of memory subsystem 660 may also be provided as anon-transitory machine-readable medium for storing thecomputer-executable instructions (e.g., instructions to implement anyother processes discussed herein). The machine-readable medium mayinclude, but is not limited to, flash memory, optical disks, CD-ROMs,DVD ROMs, RAMs, EPROMs, EEPROMs, magnetic or optical cards, phase changememory (PCM), or other types of machine-readable media suitable forstoring electronic or computer-executable instructions. For example,some embodiments of the disclosure may be downloaded as a computerprogram (e.g., BIOS) which may be transferred from a remote computer(e.g., a server) to a requesting computer (e.g., a client) by way ofdata signals via a communication link (e.g., a modem or networkconnection).

Connectivity component 670 may include a network interface, such as acellular interface 672 or a wireless interface 674 (so that anembodiment of computing device 600 may be incorporated into a wirelessdevice such as a cellular phone or a personal digital assistant). Insome embodiments, connectivity component 670 includes hardware devices(e.g., wireless and/or wired connectors and communication hardware) andsoftware components (e.g., drivers and/or protocol stacks) to enablecomputing device 600 to communicate with external devices. Computingdevice 600 could include separate devices, such as other computingdevices, wireless access points or base stations, as well as peripheralssuch as headsets, printers, or other devices.

In some embodiments, connectivity component 670 can include multipledifferent types of network interfaces, such as one or more wirelessinterfaces for allowing processor 610 to communicate with anotherdevice. To generalize, computing device 600 is illustrated with cellularinterface 672 and wireless interface 674. Cellular interface 672 refersgenerally to wireless interfaces to cellular networks provided bycellular network carriers, such as provided via GSM or variations orderivatives, CDMA (code division multiple access) or variations orderivatives, TDM (time division multiplexing) or variations orderivatives, or other cellular service standards. Wireless interface 674refers generally to non-cellular wireless interfaces, and can includepersonal area networks (such as Bluetooth, Near Field, etc.), local areanetworks (such as Wi-Fi), and/or wide area networks (such as WiMax), orother wireless communication.

Peripheral connections 680 may include hardware interfaces andconnectors, as well as software components (e.g., drivers and/orprotocol stacks) to make peripheral connections. It will be understoodthat computing device 600 could both be a peripheral device to othercomputing devices (via “to” 682), as well as have peripheral devicesconnected to it (via “from” 684). The computing device 600 may have a“docking” connector to connect to other computing devices for purposessuch as managing content on computing device 600 (e.g., downloadingand/or uploading, changing, synchronizing). Additionally, a dockingconnector can allow computing device 600 to connect to certainperipherals that allow computing device 600 to control content output,for example, to audiovisual or other systems.

In addition to a proprietary docking connector or other proprietaryconnection hardware, computing device 600 can make peripheralconnections 680 via common or standards-based connectors. Common typesof connectors can include a Universal Serial Bus (USB) connector (whichcan include any of a number of different hardware interfaces), aDisplayPort or MiniDisplayPort (MDP) connector, a High DefinitionMultimedia Interface (HDMI) connector, a Firewire connector, or othertypes of connectors.

Reference in the specification to “an embodiment,” “one embodiment,”“some embodiments,” or “other embodiments” means that a particularfeature, structure, or characteristic described in connection with theembodiments is included in at least some embodiments, but notnecessarily all embodiments. The various appearances of “an embodiment,”“one embodiment,” or “some embodiments” are not necessarily allreferring to the same embodiments. If the specification states acomponent, feature, structure, or characteristic “may,” “might,” or“could” be included, that particular component, feature, structure, orcharacteristic is not required to be included. If the specification orclaim refers to “a” or “an” element, that does not mean there is onlyone of the elements. If the specification or claims refer to “anadditional” element, that does not preclude there being more than one ofthe additional element.

Furthermore, the particular features, structures, functions, orcharacteristics may be combined in any suitable manner in one or moreembodiments. For example, a first embodiment may be combined with asecond embodiment anywhere the particular features, structures,functions, or characteristics associated with the two embodiments arenot mutually exclusive.

While the disclosure has been described in conjunction with specificembodiments thereof, many alternatives, modifications and variations ofsuch embodiments will be apparent to those of ordinary skill in the artin light of the foregoing description. For example, other memoryarchitectures e.g., Dynamic RAM (DRAM) may use the embodimentsdiscussed. The embodiments of the disclosure are intended to embrace allsuch alternatives, modifications, and variations as to fall within thebroad scope of the appended claims.

In addition, well known power/ground connections to integrated circuit(IC) chips and other components may or may not be shown within thepresented figures, for simplicity of illustration and discussion, and soas not to obscure the disclosure. Further, arrangements may be shown inblock diagram form in order to avoid obscuring the disclosure, and alsoin view of the fact that specifics with respect to implementation ofsuch block diagram arrangements are highly dependent upon the platformwithin which the present disclosure is to be implemented (i.e., suchspecifics should be well within purview of one skilled in the art).Where specific details (e.g., circuits) are set forth in order todescribe example embodiments of the disclosure, it should be apparent toone skilled in the art that the disclosure can be practiced without, orwith variation of, these specific details. The description is thus to beregarded as illustrative instead of limiting.

An abstract is provided that will allow the reader to ascertain thenature and gist of the technical disclosure. The abstract is submittedwith the understanding that it will not be used to limit the scope ormeaning of the claims. The following claims are hereby incorporated intothe detailed description, with each claim standing on its own as aseparate embodiment.

We claim:
 1. A method comprising: processing an inputted systemcapabilities list including one or more hardware design capabilities;establishing one or more candidate components for the one or morehardware design capabilities; and determining a set of unique candidatenetlists capable of satisfying the one or more hardware designcapabilities, the set of unique candidate netlists being based upon theset of candidate components, wherein the unique candidate netlistsincorporate components interconnected via a programmable siliconinterposer, wherein the programmable silicon interposer includes anintegrated circuit.
 2. The method of claim 1, wherein the inputtedcapabilities list comprises a sensor.
 3. The method of claim 1, whereinthe one or more candidate components include a microprocessor.
 4. Themethod of claim 1, wherein the establishing is to include one or morepredetermined components, and wherein the unique candidate netlistsinclude the one or more predetermined components.
 5. The method of claim4, wherein the one or more predetermined components include amicroprocessor.
 6. The method of claim 1, wherein the one or morecandidate components support at least one communication protocol.
 7. Themethod of claim 1, comprising: analyzing the set of unique candidatenetlists based upon one or more solution space constraints to produce acorresponding set of rankings for the set of unique candidate netlists.8. The method of claim 7, wherein the solution space constraints includeat least one of: a size constraint, a power constraint, a costconstraint, or a preferred-component constraint.
 9. The method of claim8, comprising: verifying the set of unique candidate netlists againstone or more rule-sets.
 10. The method of claim 9, wherein the one ormore rule-sets include at least one of: an Electrical Rule Check (ERC)rule-set; or a Design Rule Check (DRC) rule-set.
 11. The method of claim1 comprising ranking the unique candidate netlists based on userpreference, cost, risk, size and/or power.
 12. The method of claim 1comprising: identifying a set of possible combination of I2C basedcomponents associated with the one or more candidate components;identifying a set of possible configuration of SPI based componentsassociated with the one or more candidate components; and performingcross-product of the identified set of possible combination of the I2Cbased components and the identified set of possible configuration of theSPI based components.
 13. The method of claim 1 comprising: identifyingentry of a new component into a table, wherein the new component is inaddition to the one or more candidate components; and building one ormore unique systems in response to identifying entry of the newcomponent.
 14. A method comprising: processing an inputted capabilitieslist including one or more hardware design capabilities; processing aninputted set of system information including one or more candidatecomponents for the one or more hardware design capabilities and one ormore solution space constraints; determining a set of unique candidatenetlists capable of satisfying the one or more hardware designcapabilities, the set of unique candidate netlists being based upon theset of candidate components; and analyzing the set of unique candidatenetlists based upon the one or more solution space constraints toproduce a corresponding set of rankings for the set of unique candidatenetlists, wherein the unique candidate netlists incorporate componentsinterconnected via a programmable silicon interposer, wherein theprogrammable silicon interposer includes an integrated circuit.
 15. Themethod of claim 14, wherein the processing the input set is to includeone or more predetermined components, and wherein the unique candidatenetlists include the one or more predetermined components.
 16. Themethod of claim 14, wherein the one or more candidate components supportat least one communication protocol.
 17. The method of claim 14,comprising: verifying the set of unique candidate netlists against oneor more rule-sets.
 18. Machine readable storage medium having machineexecutable instructions stored thereon that, when executed, cause one ormore processors to perform an operation comprising: processing aninputted capabilities list including one or more hardware designcapabilities; establishing one or more candidate components for the oneor more hardware design capabilities; and determining a set of uniquecandidate netlists capable of satisfying the one or more hardware designcapabilities, the set of unique candidate netlists being based upon theset of candidate components, wherein the unique candidate netlistsincorporate components interconnected via a programmable siliconinterposer, wherein the programmable silicon interposer includes anintegrated circuit.
 19. The machine readable storage medium of claim 18,wherein the establishing is to include one or more predeterminedcomponents, and wherein the unique candidate netlists include the one ormore predetermined components.
 20. The machine readable storage mediumof claim 18, the operation further comprising: analyzing the set ofunique candidate netlists based upon one or more solution spaceconstraints to produce a corresponding set of rankings for the set ofunique candidate netlists.
 21. The machine readable storage medium ofclaim 18, wherein the components interconnected via the siliconinterposer are for mounting to the silicon interposer.